1. Regular Cleaning & Maintenance
1.1 Clean after every use: Remove flux residues and solder build-up using soft brushes or dedicated nozzle cleaning tools, KOKI cleaning solvents, and use cotton swabs like below.
1.2 Inspect for wear or damage regularly and replace before performance degrades.
Note: Cleaning work can be carried out directly on selective wave soldering because the equipment is equipped with a nitrogen protection device.
2. Avoid mechanical collision:
Calibrate the distance between the PCB and the nozzle (recommended 1.5~3mm) to prevent the ceramic nozzle from breaking due to PCB collision.
3. Use Proper Flux
Select low-residue fluxes: These reduce the buildup of corrosive byproducts that can damage the nozzle.
Suggested for material: titanium alloy or ceramic-coated solder nozzles for better corrosion resistance. Flux to prevent secondary oxidation.
Avoid aggressive fluxes unless necessary, and ensure proper cleaning afterward.
4. Control Temperature
4.1 Avoid overheating: Excessive heat can degrade the coating on the nozzle (often titanium or ceramic-coated).
Lead-free solder (such as SAC305, SAC307); recommended temperature: 260±5°C (actual range 255~265°C).
. Lead-free solder has a higher melting point (SAC305 is about 217~220°C), and requires a higher temperature to ensure fluidity.
. Exceeding 270°C will accelerate the oxidation of titanium alloy, increase solder spatter and Dross generation.
. Ceramic nozzles are resistant to high temperatures (usually >300°C), but long-term temperatures exceeding 270°C may accelerate thermal fatigue.
Lead solder (such as Sn63/Pb37); recommended temperature: 260±5°C (actual range 255~265°C).
Lead solder has a low melting point (183°C), and excessively high temperatures can easily lead to an increase in oxide slag (Dross), increasing the risk of nozzle clogging.
4.2 Special settings for ERSA equipment (reference)
If using ERSA VERSAFLOW series:
4.2.1 Set the “Dynamic Preheat” or ”Nozzle Preheat” to 150°C to reduce cold start thermal stress
4.2.2 Enable the “Dynamic Temperature Control” function to adjust the temperature fluctuation in real time (within ±2°C)
4.2.3 Enabling nitrogen protection (N₂) can reduce oxidation and allow the temperature to be lowered by 5~10°C.
5. Use Quality Solder
High-purity solder reduces contamination and oxidation.
Avoid solder with high levels of impurities that can accelerate nozzle wear.
6. Prevent Oxidation
Use a nitrogen atmosphere (if available) during soldering to reduce oxidation and dross formation.
7. Proper Storage
Store nozzles in dry, clean containers when not in use to prevent dust, moisture, or corrosion.
FAQ
Q: Does no-clean flux not need to be cleaned?
A: For high-humidity or high-reliability applications (such as automotive electronics), cleaning is recommended.
Q: What is the difference between flux and solder paste?
A: Solder paste mixed by solder powder and flux, which is used for SMT PCB mounting components; separate flux is used for wave soldering or hand soldering.
